Hierarchically Interconnected Epoxy/BN-SCMC Polymer Composites with Enhanced Thermal Conductivity
Refereed conference paper presented and published in conference proceedings

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摘要Thermal management issue has been a bottleneck with the development of modern electronics towards higher speed, miniaturization and functionalization. To address this problem, novel polymer composites with improved thermal conductivity is strongly demanded. However, traditional polymer composites with roughly designed structure and high filler content usually cannot meet the increasing requirements. In this work, hierarchical epoxy/oriented BN-SCMC (Sodium Carboxymethylcellulose) polymer composites with well-interconnected structure were successfully exploited by freeze casting and infiltrating methods. The pre-formed threedimensional (3D) BN scaffold endows the prepared composites an enhanced in-plane thermal conductivity (4.24 W m(-1)K(-1)) at 34.2 vol% BN loading. In addition, the influence of SCMC content on the morphology and thermal conductivity of composites was further investigated.
著者Hu JT, Zeng XL, Sun R, Xu JB, Wong CP
會議名稱2017 18th International Conference on Electronic Packaging Technology
會議開始日16.08.2017
會議完結日19.08.2017
會議地點Harbin
會議國家/地區中國
會議論文集題名Proceedings of 2017 18th International Conference on Electronic Packaging Technology
出版作品名稱2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)
出版年份2017
月份8
出版社IEEE
頁次416 - 420
國際標準書號978-1-5386-2972-7
語言英式英語
關鍵詞polymer composites, thermal conductivity, interconnected structure, boron nitride
Web of Science 學科類別Engineering, Electrical & Electronic;Engineering

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