Silver Nanoparticle deposited Boron Nitride Nanosheet/Nanofibrillated Cellulose Composites with Enhanced Thermal Conductivity
Refereed conference paper presented and published in conference proceedings

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摘要As modern electronics move towards miniaturization, high-degree integration and multi-functionalization, a large amount of heat will be generated during the operation of electronic devices. Redundant heat will cause the failure of electronic devices. One important solution is to fabricate thermally conductive composites to replace conventional packaging materials. Herein, we report on fabrication of silver nanoparticle deposited boron nitride nanosheet/nanofibrillated cellulose composite with a high cross-plane thermal conductivity up to 1.31 Wm(-1)K(-1). The silver nanoparticle can reduce the interface thermal resistance between adjacent boron nitride nanosheets by playing a bridge-connected role, resulting in more thermal conductive pathways inside the boron nitride nanosheet/nanofibrillated cellulose composite. In addition, the incorporation of silver does not destroy the electric insulation of the pristine boron nitride nanosheet/nanofibrillated cellulose composite. This strategy opens a new insight for the fabrication of polymer-based materials with enhanced thermal conductivity.
著者Sun JJ, Zeng XL, Sun R, Xu JB, Wong CP
會議名稱2017 18th International Conference on Electronic Packaging Technology
會議開始日16.08.2017
會議完結日19.08.2017
會議地點Harbin
會議國家/地區中國
會議論文集題名Proceedings of 2017 18th International Conference on Electronic Packaging Technology
出版作品名稱2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)
出版年份2017
月份8
出版社IEEE
頁次226 - 230
國際標準書號978-1-5386-2972-7
語言英式英語
關鍵詞thermal conductivity, boron nitride, cellulose, interface thermal resistance
Web of Science 學科類別Engineering, Electrical & Electronic;Engineering

上次更新時間 2020-26-11 於 02:46