Fabrication and Thermal Conduction Mechanism of Epoxy/Modified SiCNP Polymer Composites
Refereed conference paper presented and published in conference proceedings


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AbstractTo protect electronic components from being affected by heat, and improve the reliability, performance and lifetime of electronic devices, exploitation of thermally conductive polymer composites should be highlighted. Herein, we report on functionalized silicon carbide nanoparticles (SiCNPs) in polymer to fabricate an epoxy/SiCNP composite with a high thermal conductivity of 0.79 W m(-1)K(-1). Some schematic models were employed to demonstrate that the introduced SiCNPs forms thermally conductive networks at the filler loading above the percolation threshold, which is regard as the primary factor of thermal conductivity improvement for the composites. This work paves a way for preparing high thermally conductive polymer composites to address the heat-management issue.
All Author(s) ListHuang Y, Zeng XL, Sun R, Xu JB, Wong CP
Name of Conference2017 18th International Conference on Electronic Packaging Technology
Start Date of Conference16/08/2017
End Date of Conference19/08/2017
Place of ConferenceHarbin
Country/Region of ConferenceChina
Proceedings TitleProceedings of 2017 18th International Conference on Electronic Packaging Technology
Title of Publication2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)
Year2017
Month8
PublisherIEEE
Pages688 - 692
ISBN978-1-5386-2972-7
LanguagesEnglish-United Kingdom
Keywordsthermal conductivity, polymer composite, silicon carbide nanoparticles
Web of Science Subject CategoriesEngineering, Electrical & Electronic;Engineering

Last updated on 2020-13-10 at 03:37