A Novel Organic Substrate with Enhanced Thermal Conductivity
Refereed conference paper presented and published in conference proceedings


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AbstractThe continuing miniaturization and increasing power density of modern electronics make thermal-management a critical challenge for advanced materials used in electronic packaging field. As an important element of electronic packages, the thermal-conduction property of substrates plays an important role in heat removal. Polymer composites are commonly used in substrates because of their ease of large production, light weight, and excellent flexibility compared with ceramics. However, the traditional approaches to fabricating thermally conductive polymer composites usually suffer from a low thermal conductivity enhancement and/or the deterioration of mechanical property. In this study, using hexagonal boron nitride as thermally conductive filler and glass fibers as mechanically reinforced fillers liquid crystal epoxy composites, A kind of novel highly thermally conductive polymer composite that can be used as an organic substrate was prepared. The composite with a hexagonal boron nitride weight loading of 50 wt% exhibit the maximum in-plane and through-plane thermal conductivities of 5.85 and 1.60 W/m K, respectively. In addition, the polymer composites also possess good thermal stability, low dielectric permittivity, and excellent mechanical properties. This work provides a high thermally conductive organic substrate for advanced electronic packaging.
All Author(s) ListZeng XL, Yao YM, Hu YG, Guo K, Sun JJ, Sun R, Xu JB, Wong CP
Name of ConferenceIEEE 67th Electronic Components and Technology Conference (ECTC)
Start Date of Conference30/05/2017
End Date of Conference02/06/2017
Place of ConferenceLake Buena Vista, FL
Country/Region of ConferenceUnited States of America
Journal nameElectronic Components and Technology Conference
Proceedings TitleProceedings of IEEE 67th Electronic Components and Technology Conference (ECTC)
Title of Publication2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017)
Year2017
Month8
PublisherIEEE
Pages144 - 149
ISSN0569-5503
LanguagesEnglish-United Kingdom
Web of Science Subject CategoriesEngineering, Electrical & Electronic;Engineering

Last updated on 2020-13-10 at 03:37