Preparation and Characterization of Al2O3-AgNP hybrids for Application in Thermally Conductive Polymer Composites
Refereed conference paper presented and published in conference proceedings

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AbstractWith the fast development of the integrated circuit towards high density, miniaturization, multi-functionalization, heat management become one of the top priority issues to be addressed. Owing to excellent physical and chemical properties, especially excellent flexibility, polymers have wide applications in electronic. Nevertheless, most polymers possess thermal conductivity below 0.5 W/mK, which cannot meet the requirement in modern electronics with high power density and high speed. Conventionally, thermally conductive fillers are used to enhance the polymers' thermal conductivity. Unfortunately, the enhancement of thermal conductivity is limited even at the high-volume fractions of filler (50% in volume). Herein, we report on an effective approach to preparing Al2O3-AgNP hybrids liquid-phase chemical reduction method. The Al2O3-AgNP hybrids consist of silver nanoparticles (AgNP) decorated aluminum oxide (Al2O3) microball. The structure and morphology of Al2O3-AgNP hybrids were confirmed. We demonstrated that the Ag nanoparticles with the size of 40-50 nm were uniformly decorated on the Al2O3 surface, and the amount of Ag nanoparticles also can be tunable. We believe that this method has potential in preparing Al2O3-based polymer materials for application in thermally conductive polymer composites.
All Author(s) ListRen LL, Zeng XL, Sun R, Xu JB, Wong CP
Name of Conference2018 19th International Conference on Electronic Packaging Technology (ICEPT)
Start Date of Conference08/08/2018
End Date of Conference11/08/2018
Place of ConferenceShanghai
Country/Region of ConferenceChina
Proceedings TitleProceedings of THE 19th International Conference on Electronic Packaging Technology
Pages1205 - 1208
LanguagesEnglish-United Kingdom
KeywordsThermal management, Thermally conductive fillers, Aluminum oxide, Silver, Hybrids
Web of Science Subject CategoriesEngineering, Electrical & Electronic;Engineering

Last updated on 2020-23-10 at 02:36