A novel graphene oxide millispheres / epoxy resin composite with improved thermal conductivity
Refereed conference paper presented and published in conference proceedings

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AbstractIn order to protect electronic equipments from thermal damage and improve their reliability, longevity and performance, high thermal conductivity polymer composites have attracted widespread attention in recent years. However, traditional polymer composites typically have a low thermal conductivity, hardly satisfying the continuous demand for high-performance thermal-management materials. In addition, the preparation process of traditional composites is usually complex. Herein, we report on a novel method for preparing graphene oxide millisphere, and composites made of these graphene oxide millispheres, which have a maximum out-of-plane thermal conductivity of 1.179 W m 1K(-1) and high thermal conductivity increasing rate of 39% to 111%. The graphene oxide millispheres in the composites can form highly ordered three-dimensional heat conduction structure in the matrix, which effectively reduces the interface thermal resistance and improves the thermal conductivity of the composite. These results indicate that the composite material can be well applied in the field of advanced electronic packaging, and this experiment opens up a new path for further research on polymer composite materials with high thermal conductivity.
All Author(s) ListLi C, Zeng XL, Zhu DL, Sun R, Xu JB, Wong CP
Name of Conference19th International Conference on Electronic Packaging Technology (ICEPT 2018)
Start Date of Conference08/08/2018
End Date of Conference11/08/2018
Place of ConferenceShanghai
Country/Region of ConferenceChina
Proceedings TitleProceedings of the 19th International Conference on Electronic Packaging Technology (ICEPT 2018)
Place of PublicationShanghai, China
Pages546 - 550
LanguagesEnglish-United Kingdom
Keywordsfillers, thermal conductivity, graphene oxide millispheres, epoxy resin
Web of Science Subject CategoriesEngineering, Electrical & Electronic;Engineering

Last updated on 2020-13-10 at 03:37