A Combination of Boron Nitride Nanotubes and Cellulose Nanofibers for the Preparation of a Nanocomposite with High Thermal Conductivity
Publication in refereed journal

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摘要With the current development of modern electronics toward miniaturization, high-degree integration and multifunctionalization, considerable heat is accumulated, which results in the thermal failure or even explosion of modern electronics. The thermal conductivity of materials has thus attracted much attention in modern electronics. Although polymer composites with enhanced thermal conductivity are expected to address this issue, achieving higher thermal conductivity (above 10 W m–1 K–1) at filler loadings below 50.0 wt % remains challenging. Here, we report a nanocomposite consisting of boron nitride nanotubes and cellulose nanofibers that exhibits high thermal conductivity (21.39 W m–1 K–1) at 25.0 wt % boron nitride nanotubes. Such high thermal conductivity is attributed to the high intrinsic thermal conductivity of boron nitride nanotubes and cellulose nanofibers, the one-dimensional structure of boron nitride nanotubes, and the reduced interfacial thermal resistance due to the strong interaction between the boron nitride nanotubes and cellulose nanofibers. Using the as-prepared nanocomposite as a flexible printed circuit board, we demonstrate its potential usefulness in electronic device-cooling applications. This thermally conductive nanocomposite has promising applications in thermal interface materials, printed circuit boards or organic substrates in electronics and could supplement conventional polymer-based materials.
著者Xiaoliang Zeng, Jiajia Sun, Yimin Yao, Rong Sun, Jian-Bin Xu, Ching-Ping Wong
期刊名稱ACS Nano
出版年份2017
月份5
日期23
卷號11
期次5
頁次5167 - 5178
國際標準期刊號1936-0851
電子國際標準期刊號1936-086X
語言美式英語
關鍵詞boron nitride nanotubes, cellulose nanofibers, interfacial thermal resistance, nanocomposites, thermal conductivity

上次更新時間 2020-21-11 於 02:27