SPICE Simulation of VLSI Interconnects Modeled by Transmission Lines with Skin Effects
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All Author(s) ListYu, Q.-J., WING Omar
Name of ConferenceProceedings of IEEE Topical Meeting on Electrical Performance of Electronic Packaging
Country/Region of ConferenceUnited States of America
Proceedings TitleProceedings of IEEE Topical Meeting on Electrical Performance of Electronic Packaging
Year1993
Month10
PublisherIEEE
Place of PublicationUnited States of America, Monterey, California, USA
LanguagesEnglish-United Kingdom
KeywordsTRANSMISSION LINES ; VLSI CAD

Last updated on 2018-17-01 at 14:22