Yield enhancement for 3D-stacked ICs: Recent advances and challenges
Invited conference paper presented and published in conference proceedings

香港中文大學研究人員

全文

其它資訊
著者XU Qiang, JIANG, Li, LI Hui Yun, EKLOW Bill
會議名稱IEEE Asia South Pacific Design Automation Conference
會議論文集題名IEEE Asia South Pacific Design Automation Conference
詳細描述organized by IEEE,
出版年份2012
頁次7
語言英式英語
關鍵詞Three Dimensional Integrated Circuit; Yield Enhancement

上次更新時間 2018-23-01 於 22:42