Yield enhancement for 3D-stacked ICs: Recent advances and challenges
Invited conference paper presented and published in conference proceedings


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All Author(s) ListXU Qiang, JIANG, Li, LI Hui Yun, EKLOW Bill
Name of ConferenceIEEE Asia South Pacific Design Automation Conference
Proceedings TitleIEEE Asia South Pacific Design Automation Conference
Detailed descriptionorganized by IEEE,
Year2012
Pages7
LanguagesEnglish-United Kingdom
KeywordsThree Dimensional Integrated Circuit; Yield Enhancement

Last updated on 2018-23-01 at 22:42