Polymeric Nanocomposites for Advanced Electronic and Photonic Packaging Applications
Invited conference paper presented and published in conference proceedings
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其它資訊
著者WONG Ching Ping
會議名稱International Forum on Advanced Materials and Commercialisation
會議國家/地區中國
會議論文集題名International Forum on Advanced Materials and Commercialisation
出版年份2011
月份11
出版地China, Ningbo
語言英式英語
