On-Chip Dynamic Programming Networks Design in TSV-Based 3D Stacking Technology
Refereed conference paper presented and published in conference proceedings


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All Author(s) ListMAK Sui Tung Terrence, AL-DUJAILY R., ZHOU K., LAM K.P., POON C. S.
Name of ConferenceGovernment Microcircuit Applications and Critical Technology Conference (GOMACTech-11)
Country/Region of ConferenceUnited States of America
Proceedings TitleGovernment Microcircuit Applications and Critical Technology Conference (GOMACTech-11)
Detailed descriptionorganized by The Trusted Supplier Steering Committee,
Year2011
Month3
Place of PublicationUnited States of America, Orlando
LanguagesEnglish-United Kingdom
KeywordsOn-chip; TSV-based; 3D Stacking

Last updated on 2018-18-01 at 11:22