Advanced Design Methodologies for LTCC RF Modules
Invited conference paper presented and published in conference proceedings


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All Author(s) ListWU Ke-Li, ZHANG Rui, EHLERT Michael, MILLER Bob, FANG Da-Gang
Country/Region of ConferenceUnited States of America
Detailed descriptionPaper presented in International Workshop of Ceramic Technologies for Microwave, organized by International Microelectronics and Packaging Society.
Year2001
Month3
Place of PublicationUnited States of America, Colorado USA
LanguagesEnglish-United Kingdom
KeywordsLTCC ; MULTI-CHIP-MODULE ; OPTIMIZATION DESIGN

Last updated on 2018-19-01 at 01:02