Wafer-Level Hermetic All-Glass Packaging for Microalkali Vapor Cells of Chip-Scale Atomic Devices
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AbstractTo maintain a controllable environment for microalkali vapor cells of high-performance chip-scale atomic devices, a novel wafer-level hermetic all-glass packaging technology for microalkali vapor cells of atomic devices was investigated. A glass wafer with metal vias was used as the substrate to host the miroalkali vapor cells. Wafer-level hemispherical glass bubbles prepared by a chemical foaming process were used as transparent packaging caps. The performance of the rubidium vapor cell in the all-glass hermetic package was characterized by a laser frequency locking system and an ultraviolet spectrophotometer. The results show that hermetic all-glass packaging at a wafer level was demonstrated successfully. The results also indicate that after the hermetic all-glass packaging, the temperature variation of the microalkali vapor cells was controllably below 0.2 degrees C at different working temperatures of atomic devices. A chip-scale atomic magnetometer using the hermetic all-glass micro vapor cell was demonstrated eventually.
All Author(s) ListJi Y, Gan Q, Wu L, Shang JT, Wong CP
Journal nameIEEE Transactions on Components, Packaging, and Manufacturing Technology
Year2015
Month11
Volume Number5
Issue Number11
PublisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Pages1551 - 1558
ISSN2156-3950
LanguagesEnglish-United Kingdom
KeywordsAtomic devices; chemical foaming process (CFP); hot forming process; microrubidium vapor cell; optically pumped atomic magnetometer; ultraviolet spectrophotometer; wafer-level hermetic package
Web of Science Subject CategoriesEngineering; Engineering, Electrical & Electronic; Engineering, Manufacturing; Materials Science; Materials Science, Multidisciplinary

Last updated on 2020-18-09 at 02:14