Fixed-outline thermal-aware 3D floorplanning
Refereed conference paper presented and published in conference proceedings

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AbstractIn this paper, we present a novel algorithm for 3D floorplanning with fixed outline constraints and a particular emphasis on thermal awareness. A computationally efficient thermal model that can be used to guide the thermal-aware floorplanning algorithm to reduce the peak temperature is proposed. We also present a novel white space redistribution algorithm to dissipate hotspot. Thermal through-silicon via (TSV) insertion is performed during the floorplanning process as a means to control the peak temperature. Experimental results are very promising and demonstrate that the proposed floorplanning algorithm has a high success rate at meeting the fixed-outline constraints while effectively limiting the rise in peak temperature.
All Author(s) ListXiao L., Sinha S., Xu J., Young E.F.Y.
Name of Conference2010 15th Asia and South Pacific Design Automation Conference, ASP-DAC 2010
Start Date of Conference18/01/2010
End Date of Conference21/01/2010
Place of ConferenceTaipei
Country/Region of ConferenceTaiwan
Detailed descriptionorganized by IEEE,
Pages561 - 567
LanguagesEnglish-United Kingdom

Last updated on 2021-19-02 at 00:03