An Effective Chemical Mechanical Polishing Fill Insertion Approach
Publication in refereed journal


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其它資訊
摘要To reduce chip-scale topography variation, dummy fill is commonly used to improve the layout density uniformity. Previous works either sought the most uniform density distribution or sought to minimize the inserted dummy fills while satisfying certain density uniformity constraint. However, due to more stringent manufacturing challenges, more criteria, like line deviation and outlier, emerge at newer technology nodes. This article presents a joint optimization scheme to consider variation, total fill, line deviation, outlier, overlap, and running time simultaneously. More specifically, first we decompose the rectilinear polygons and partition fillable regions into rectangles for easier processing. After decomposition, we insert dummy fills into the fillable rectangular regions optimizing the fill metrics simultaneously. We propose three approaches, Fast Median approach, LP approach, and Iterative approach, which are much faster with better quality, compared with the results of the top three contestants in the ICCAD Contest 2014.
著者Liu CW, Tu PS, Wu PB, Tang HM, Jiang YD, Kuang J, Young EFY
期刊名稱ACM Transactions on Design Automation of Electronic Systems
出版年份2016
月份7
日期1
卷號21
期次3
出版社ASSOC COMPUTING MACHINERY
國際標準期刊號1084-4309
電子國際標準期刊號1557-7309
語言英式英語
關鍵詞fill insertion; filling optimization; overlap optimization; Polygon decomposition
Web of Science 學科類別Computer Science; Computer Science, Hardware & Architecture; Computer Science, Software Engineering

上次更新時間 2021-20-04 於 23:05