An Effective Chemical Mechanical Polishing Filling Approach
Refereed conference paper presented and published in conference proceedings


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AbstractTo reduce chip-scale topography variation, dummy fill is commonly used to improve the layout density uniformity. Previous work either sought the most uniform density distribution or sought to minimize the inserted dummy fills while satisfying certain density uniformity constraint. However, due to more stringent manufacturing challenges, more criteria, like line deviation and outlier, emerge at newer technology nodes. This paper presents a joint optimization scheme to consider variation, total fill, line deviation and outlier simultaneously. More specifically, first we decompose the rectilinear polygons and partition fillable regions into rectangles for easier processing. After decomposition, we insert dummy fills into the fillable rectangular regions optimizing the fill metrics simultaneously. We propose three approaches-Fast Median approach, LP approach and Iterative approach, which are much faster with better quality, compared with the results of the top three contestants in the ICCAD Contest 2014.
All Author(s) ListLiu CW, Tu PS, Wu PB, Tang HM, Jiang YD, Kuang J, Young EFY
Name of ConferenceIEEE-Computer-Society Annual Symposium on VLSI (ISVLSI)
Start Date of Conference08/07/2015
End Date of Conference10/07/2015
Place of ConferenceMontpellier
Country/Region of ConferenceFrance
Detailed descriptionIEEE Computer Society\n\nTo ORKTS: I have modified the authors correctly. Thanks.
Year2015
Month1
Day1
PublisherIEEE
Pages44 - 49
eISBN978-1-4799-8719-1
ISSN2159-3469
LanguagesEnglish-United Kingdom
KeywordsFill Insertion; Filling Optimization; Polygon Decomposition
Web of Science Subject CategoriesComputer Science; Computer Science, Hardware & Architecture; Computer Science, Theory & Methods; Engineering; Engineering, Electrical & Electronic

Last updated on 2021-13-04 at 23:20