On X-Variable Filling and Flipping for Capture-Power Reduction in Linear Decompressor-Based Test Compression Environment
Publication in refereed journal

香港中文大學研究人員

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摘要Excessive test power consumption and growing test data volume are both serious concerns for the semiconductor industry. Various low-power X-filling techniques and test data compression schemes were developed accordingly to address the above problems. These methods, however, often exploit the very same "don't-care" bits in the test cubes to achieve different objectives and hence may contradict each other. In this paper, we propose novel techniques to reduce scan capture power in linear decompressor-based test compression environment, by employing algorithmic solutions to fill and flip X-variables supplied to the linear decompressor. Experimental results on benchmark circuits demonstrate that our proposed techniques significantly outperform existing solutions.
著者Liu X, Xu Q
期刊名稱IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
出版年份2012
月份11
日期1
卷號31
期次11
出版社IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
頁次1743 - 1753
國際標準期刊號0278-0070
電子國際標準期刊號1937-4151
語言英式英語
關鍵詞Capture-power reduction; linear decompressor-based test compression; X-filling
Web of Science 學科類別Computer Science; Computer Science, Hardware & Architecture; COMPUTER SCIENCE, HARDWARE & ARCHITECTURE; Computer Science, Interdisciplinary Applications; COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS; Engineering; Engineering, Electrical & Electronic; ENGINEERING, ELECTRICAL & ELECTRONIC

上次更新時間 2020-21-10 於 00:46