Yield analysis for self-repairable MEMS devices
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摘要In this paper, yield analysis for a self-repairable MEMS (SRMEMS) accelerometer design is proposed. The accelerometer consists of (n + m) identical modules: n of them serve as the main device, while the remaining m modules act as the redundancy. The yield model for MEMS redundancy repair is developed by statistical analysis. Based upon the yield model, the yield increase after redundancy repair for different in and n numbers is analyzed. ANSYS Monte Carlo simulation is used to estimate the yield of BISR/non-BISR MEMS devices with random point-stiction defects. The simulation results are in good agreement with the theoretical prediction based on our yield model. The simulation results also show that the SRMEMS leads to effective yield increase compared to non-BISRS design, especially for a moderate initial yield.
著者Xiong XG, Wu YL, Jone WB
會議名稱48th IEEE International Midwest Symposium on Circuits and Systems (MWSCAS)
會議開始日01.01.2005
會議地點Cincinnati
期刊名稱Analog Integrated Circuits and Signal Processing
出版年份2008
月份8
日期1
卷號56
期次1-2
出版社Springer Verlag (Germany)
頁次71 - 81
國際標準期刊號0925-1030
電子國際標準期刊號1573-1979
語言英式英語
關鍵詞built-in self-repair (BISR); MEMS; micro-accelerometer; redundancy repair; yield analysis
Web of Science 學科類別Computer Science; Computer Science, Hardware & Architecture; COMPUTER SCIENCE, HARDWARE & ARCHITECTURE; Engineering; Engineering, Electrical & Electronic; ENGINEERING, ELECTRICAL & ELECTRONIC

上次更新時間 2021-25-02 於 23:54