Empirical Passive Intermodulation Multiphysics Modeling Using Design of Experiment Method
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AbstractThis work presents a numerical modeling of passive intermodulation (PIM) product on contact junction under the multiphysics condition. The carrier power, temperature, and pressure impacts are combined into the model using design of experiment method. Based on several sets of optimized PIM test conditions, an empirical PIM model versus multiphysics can be established. The experiment demonstrates that the proposed PIM modeling method can predict PIM product with the max error of 7 dB.
All Author(s) ListChen X, Wang L, Yang S, Yu M
Journal nameIEEE Transactions on Instrumentation and Measurement
Year2020
Month12
Volume Number69
Issue Number12
PublisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Pages9371 - 9373
ISSN0018-9456
eISSN1557-9662
LanguagesEnglish-United Kingdom
KeywordsJunctions, Semiconductor lasers, Fitting, Numerical models, Force, Microwave devices, Contact junction, design of experiment (DOE), passive intermodulation (PIM), response surface methodology (RSM)
Web of Science Subject CategoriesEngineering, Electrical & Electronic;Instruments & Instrumentation;Engineering;Instruments & Instrumentation

Last updated on 2021-14-06 at 00:08