Dual-beam stealth laser dicing based on electrically tunable lens
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AbstractIn this paper, we present the development of a high-speed dual-beam stealth laser dicing (D-SLD) method for processing semiconductor wafers based on electrically tunable lenses (ETLs). An SLD system utilizes a laser beam to dice a wafer by inducing interior defects without modifying the surface characteristics of a wafer, thereby presenting significant advantages over conventional dicing methods, e.g., blade dicing or laser ablation. Currently, the throughput of SLD is limited by the serial scanning process; in addition, wafer misalignment and the warpage effects together deteriorate the dicing quality and yield and demand high-cost multi-axis precision stages. To address the issue, we parallelize the dicing process by splitting the laser focus into two foci, where the laser intensity at different depths are automatically adjusted to achieve optimal dicing condition. By combining the height sensor and ETLs, each laser focus, i.e., laser scan lines, can be rapidly controlled axially to compensate the wafer curvature and misalignment errors in real time, leading to substantially improved precision (kerf width < 2 μm) and speed, demonstrated by our experimental results. The new dual-beam laser dicing system presents an effective solution for high-speed wafer dicing as well as other important engineering applications, e.g., fabrication of micro-devices and optical components.
Acceptance Date17/08/2020
All Author(s) ListHiu Hung Lee, Erxuan Zhao, Dihan Chen, Nan Zhang, Shih-Chi Chen
Journal namePrecision Engineering
Year2020
Month11
Volume Number66
PublisherElsevier
Place of PublicationUSA
Pages374 - 381
ISSN0141-6359
eISSN1873-2372
LanguagesEnglish-United States
Keywordslaser dicing, wafer dicing, dual beam

Last updated on 2020-11-10 at 23:45