Bessel Beam Array for High Resolution Wafer Dicing
Refereed conference paper presented and published in conference proceedings


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AbstractIn this paper, we present a new parallel micro-machining method based on the generation and control of multiple Bessel beams. The new method may realize ultrafast high-resolution (1000 mm/s; < 3 μm kerf) stealth laser dicing on glass or semiconductor wafers. In our study, a spatial light modulator (SLM) is used to generate multiple Bessel beams from a femtosecond laser; each Bessel beam’s characteristics (e.g., aspect ratio and intensity distribution) and location can be controlled directly through the SLM. Mathematical models as well as experimental results are presented to demonstrate the improved dicing speed and resolution.
Acceptance Date01/08/2018
All Author(s) ListHiu Hung Lee, Erxuan Zhao, Wei Lin, Yina Chang, Shih-Chi Chen
Name of ConferenceAnnual Meeting of the American Society for Precision Engineering
Start Date of Conference04/11/2018
End Date of Conference09/11/2018
Place of ConferenceLas Vegas, NV
Country/Region of ConferenceUnited States of America
Proceedings TitleProceedings of the Annual Meeting of the American Society for Precision Engineering
Year2018
Month11
Day4
Place of PublicationUSA
LanguagesEnglish-United States
KeywordsBessel Beam, Wafer Dicing

Last updated on 2020-04-05 at 11:14