A Lifetime Reliability-Constrained Runtime Mapping for Throughput Optimization in Many-Core Systems
Publication in refereed journal

Times Cited
Altmetrics Information

Other information
AbstractDue to technology scaling, lifetime reliability is becoming one of the major design constraints in the performance optimization of future many-core systems. Given a lifetime reliability constraint, the existing lifetime-constrained runtime mapping schemes often lead to low throughput because of the requirement to map all applications to compact regions. In this paper, we propose a runtime application mapping scheme that exploits a borrowing strategy to improve the throughput of many-core systems given a lifetime constraint. First, we propose using different strategies for mapping communication-intensive applications and computation-intensive applications. The lifetime reliability constraint can be relaxed in the local time scale when the communication requirement is high. The throughput is improved because the communication distance of communication-intensive applications is optimized while the waiting time of computation-intensive application is reduced. Then, we propose a method to effectively classify applications depending on the communication-to-computation ratio. A dynamic threshold is determined according to the current locations of available cores. Finally, we propose an improved neighborhood allocation scheme to reduce the communication cost in the task mapping. The experimental results show that compared to the state-of-theart lifetime-constrained mapping, the proposed mapping scheme improves the throughput of many-core systems by 26% on average for synthetic task graphs and by 20% on average for realistic task graphs while the lifetime reliability is maintained within a constraint.
All Author(s) ListLiang Wang, Ping Lv, Leibo Liu, Jie Han, Ho-fung Leung, Xiaohang Wang, Shouyi Yin, Shaojun Wei, Terrence Mak
Journal nameIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Volume Number38
Issue Number9
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Pages1771 - 1784
LanguagesEnglish-United States

Last updated on 2020-02-08 at 00:25