63-Layer TCM Wiring with Three-Dimensional Crosstalk Constraints
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All Author(s) ListWONG Chak Kuen, H.H. Chen
Journal nameInternational Journal of High Speed Electronics and Systems
Year1995
Month9
Volume Number3
Issue Number6
Place of PublicationSingapore, Singapore
Pages497
ISSN0129-1564
LanguagesEnglish-United Kingdom

Last updated on 2018-19-01 at 23:25